Addition of SiF4 to standard SiH4+H2 plasma: An effective way to reduce oxygen contamination in μc-Si:H films

Physica Status Solidi (C) Current Topics in Solid State Physics

Volumn 7, Issue 3-4, 2010, Pages 529-532

  Abramov, Alexey ^a   Roca I Cabarrocas, Pere ^a  

^a LABORATOIRE DE PHYSIQUE DES INTERFACES ET DES COUCHES MINCES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DARK CONDUCTIVITY; DEPOSITION TEMPERATURES; HYDROGEN GAS; OXYGEN CONTAMINATION; OXYGEN INCORPORATION; REDUCTION OF OXYGEN; SILICON TETRAFLUORIDE;

METALLIC FILMS; OXYGEN;

MICROCRYSTALLINE SILICON;

EID: 77952573676     PISSN: 18626351     EISSN: 16101642     Source Type: Journal    
DOI: 10.1002/pssc.200982798     Document Type: Conference Paper

References (16)

1. P. Torres, J.Meier, R.Fluckiger, U. Kroll, J. A. Anna Selvan, H. Keppner, A. Shah, S. D. Littlewood, I.E. Kelly, and P. Giannoules, Appl. Phys. Lett. 69, 1373 (1996).
2. S. Klein, F. Finger, R. Carius and M. Stutzmann, J. Appl. Phys. 98, 024905 (2005).
3. T. Kamei and T. Wada, J. Appl. Phys. 96, 2087-2090 (2004).
4. T. Nagahara, K. Fujimoto, N. Kohno, Y. Kashiwagi, and H. Kakinoki, Jpn. J. Appl. Phys. 31, 4555-4558 (1992).
5. L.J. Quinn, B. Lee, P.T. Baine, S.J.N. Mitchell, B.M. Armstrong, and H.S. Gamble, Thin Solid Films 296, 7-10 (1997).
6. Y. Djeridane, A. Abramov, and P. Roca i Cabarrocas, Thin Solid Films 515, 7451 (2007).
7. I.-C. Cheng, S. Wagner, IEE Proc.-Circuits Devices Syst. 150, 339-344 (2003).
8. P. Roca i Cabarrocas, J.B. Chevrier, J. Huc, A. Lloret, J.Y. Parey, J.P.M. Schmitt, J. Vac. Sci. Technol. A 9, 2331 (1991).
9. A. Abramov, P. Roca i Cabarrocas, K. Girotra, H. Chen, S. Park, K. Park, J. Huh, J. Choi, C. Kim, and J. H. Souk, Jpn. J. Appl. Phys. 47, 7308-73010 (2008).
10. A. Abramov, P. Roca i Cabarrocas, H. Chen, S. Park, K. Park, J. Huh, J. Choi, C. Kim, and J. H. Souk (to be published).
11. R. Q. Zhang and Y. L. Zhao, Phys. Rev. B 69, 125319 1-8 (2004).
12. T. Akasaka, D. He, Y. Miyamoto, N. Kitazawa, and I. Shimizu, Thin Solid Films 296, 2-6 (1997).
13. K. Nakahata, A. Miida, T. Kamiya, C.M. Fortmann, and I. Shimizu, Thin Solid Films 337, 45-50 (1999).
14. T. Kamiya, K. Nakahata, A. Miida, C.M. Fortmann, and I. Shimizu, Thin Solid Films 337, 18-22 (1999).
15. T. Kamei, M. Kondo, and A. Matsuda, Jpn. J. Appl. Phys. 37, L265-268 (1998).
16. Y. Nasuno, M. Kondo, and A. Matsuda, Appl. Phys. Lett. 78, 2330-2332 (2001).