Direct-liquid-injection chemical vapor deposition of nickel nitride films and their reduction to nickel films

Chemistry of Materials

Volumn 22, Issue 10, 2010, Pages 3060-3066

  Li, Zhefeng ^a   Gordon, Roy G ^a   Pallem, Venkateswara ^a   Li, Huazhi ^b   Shenai, Deo V ^b  

^a HARVARD UNIVERSITY   (United States)

^b Dow Electronic Materials   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMIDINATES; ATOMIC RATIO; CONTINUOUS FILMS; COREACTANTS; HIGH ASPECT RATIO; HYDROGEN PLASMA TREATMENTS; INJECTION CHEMICAL VAPOR DEPOSITION; NICKEL FILM; NITRIDE FILMS; ROOM TEMPERATURE; STEP COVERAGE; SUBSTRATE TEMPERATURE;

ASPECT RATIO; LIQUIDS; METALLIC FILMS; NICKEL; NICKEL ALLOYS; NICKEL COMPOUNDS; NITRIDES; NITROGEN PLASMA; PLASMA APPLICATIONS;

CHEMICAL VAPOR DEPOSITION;

EID: 77952491579     PISSN: 08974756     EISSN: 15205002     Source Type: Journal    
DOI: 10.1021/cm903636j     Document Type: Article

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