EUVL - Towards implementation in production

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7520, Issue , 2009, Pages

  Meiling, Hans ^a   Buzing, Nico ^a   Cummings, Kevin ^b   Harned, Noreen ^b   Hultermans, Bas ^a   De Jonge, Roel ^a   Kessels, Bart ^b   Kürz, Peter ^c   Lok, Sjoerd ^a   Lowisch, Martin ^c   Mallman, Joerg ^a   Pierson, Bill ^b   Wagner, Christian ^a   Van Dijk, Andre ^a   Van Setten, Eelco ^a   Zimmerman, John ^b   Cheang, Peter ^d   Chen, Alek ^d  

^a ASML   (Netherlands)

^b ASML US Inc   (United States)

^c CARL ZEISS SMT AG   (Germany)

^d ASML Taiwan Ltd   (Taiwan)

Author keywords

Devices; EUV lithography; High volume manufacturing; Resist images; Sources; System performance

Indexed keywords

CONTACT HOLES; COST-EFFECTIVE MEANS; CRITICAL LEVEL; EUV LITHOGRAPHY; EUVL SYSTEMS; FULL-FIELD; HIGH VOLUME MANUFACTURING; IMAGING DATA; KEY FEATURE; METAL LAYER; PROCESS DEVELOPMENT; PROJECTION LENS; RESEARCH CENTER; RESIST IMAGE; ROADMAP; SEMICONDUCTOR CHIPS; SINGLE EXPOSURE; SINGLE PLATFORM; STEP-AND-SCAN; SYSTEM DESCRIPTION; SYSTEM IMPLEMENTATION; TECHNOLOGY NODES; TOOL GENERATION;

COSTS; DRILLING PLATFORMS; LENSES; LITHOGRAPHY; OPTICAL INSTRUMENTS; PRODUCTION PLATFORMS; TECHNOLOGICAL FORECASTING; ULTRAVIOLET DEVICES;

EXTREME ULTRAVIOLET LITHOGRAPHY;

EID: 77952086529     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.845781     Document Type: Conference Paper

References (19)

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