A wavelet-based approach in detecting visual defects on semiconductor wafer dies

IEEE Transactions on Semiconductor Manufacturing

Volumn 23, Issue 2, 2010, Pages 284-292

  Yeh, Chi Hao ^a   Wu, Ful Chiang ^b   Ji, Wei Lung ^c   Huang, Chien Yi ^a  

^a NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b VANUNG UNIVERSITY   (Taiwan)

^c WISTRON CORPORATION   (Taiwan)

Author keywords

Interscale ratio; Two dimensional wavelet transform; Visual defects; Wafer die; Wavelet transform modulus sum (WTMS)

Indexed keywords

BATCH PRODUCTION; DECOMPOSITION LEVEL; DETECTION ERROR; EDGE PIXELS; FALSE ALARMS; GRAY IMAGE; MISSED DETECTIONS; MULTIPLE SCALE; PRODUCT VARIETY; REAL ENVIRONMENTS; SEMI-CONDUCTOR WAFER; TEMPLATE-FREE; TESTING SAMPLES; TWO-DIMENSIONAL WAVELET TRANSFORM; VISUAL DEFECTS; WAFER DIES; WAVELET BASIS; WAVELET ENERGY; WAVELET-BASED APPROACH;

DEFECTS; DIES; ERROR DETECTION; HIGH PASS FILTERS; IMAGE RESOLUTION; INSPECTION; MULTIRESOLUTION ANALYSIS; PIXELS; POLLUTION DETECTION; SILICON WAFERS; TWO DIMENSIONAL;

WAVELET DECOMPOSITION;

EID: 77951984884     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2010.2046108     Document Type: Conference Paper

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