Uncovering the driving force for massive spalling in the Sn-Cu/Ni system

Scripta Materialia

Volumn 63, Issue 1, 2010, Pages 47-49

  Chen, W M ^a   Yang, S C ^a   Tsai, M H ^a   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compounds; Soldering

Indexed keywords

DESIGNED EXPERIMENTS; DRIVING FORCES; INTERMETALLIC COMPOUNDS;

SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; SPALLING;

TIN;

EID: 77951118955     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2010.03.008     Document Type: Article

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