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Journal of Electronic Materials

Volumn 39, Issue 3, 2010, Pages 295-302

A study of plasma-cleaned Ag-plated Cu leadframe surfaces

(1) Li, Wuhu a

a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD (Singapore)

Author keywords

Antitarnish layer; Copper; Integrated circuits (IC) packaging; Leadframe; Plasma cleaning; Silver

Indexed keywords

ANTITARNISH LAYER; AR PLASMAS; BEFORE AND AFTER; BENZOTRIAZOLES; CROSS CONTAMINATION; CU ATOMS; CU SURFACES; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; HIGH-POWER; LEAD-FRAME; LOW POWER; PLASMA CLEANING; PLASMA TREATMENT; REDEPOSITION; TIME OF FLIGHT SECONDARY ION MASS SPECTROMETRY;

CLEANING; CONTACT ANGLE; INTEGRATED CIRCUITS; MASS SPECTROMETRY; OPTICAL DEVICES; PLASMA APPLICATIONS; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

PLASMAS;

EID: 77951022976 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-1016-8 Document Type: Article

Times cited : (17)

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