An investigation on the plasma treatment of integrated circuit bond pads

Microelectronics Reliability

Volumn 40, Issue 7, 2000, Pages 1199-1206

  Chong, Y F ^a   Gopalakrishnan, R ^b   Tsang, C F ^b   Sarkar, G ^a   Lim, S ^c   Tatti, S ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DECONTAMINATION; INTEGRATED CIRCUITS; MICROELECTRONICS; MORPHOLOGY; OXYGEN; PASSIVATION; PLASMA APPLICATIONS; PLASMA ETCHING; SURFACE CHEMISTRY; SURFACE CLEANING; SURFACE STRUCTURE;

INTEGRATED CIRCUIT BOND PADS;

ELECTRONICS PACKAGING;

EID: 0034226177     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00047-0     Document Type: Article

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