Die attach adhesion on leadframes treated with antioxidants

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 208-214

  Huneke, James T ^a   Cowens, Marvin ^a  

^a Quantum Materials Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANTIOXIDANTS; AUGER ELECTRON SPECTROSCOPY; CHEMICAL CLEANING; SECONDARY ION MASS SPECTROMETRY;

LEADFRAMES;

ELECTRONICS PACKAGING;

EID: 0031328522     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)