Bonding strengths at plastic encapsulant-gold-plated copper leadframe interface

Microelectronics Reliability

Volumn 40, Issue 7, 2000, Pages 1207-1214

  Yi, Sung ^a   Kirn, Jang Kyo ^a,c   Yue, Chee Yoon ^a   Hsieh, Jang Hsing ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); CONTACT ANGLE; COPPER; ENCAPSULATION; GOLD PLATING; INTERFACES (MATERIALS); PLASMA APPLICATIONS; PLASTICS APPLICATIONS; SHEET MOLDING COMPOUNDS; SURFACE CLEANING; SURFACE ROUGHNESS;

PLASMA TREATMENT;

ELECTRONICS PACKAGING;

EID: 0034226123     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00048-2     Document Type: Article

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