Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes

Journal of Adhesion Science and Technology

Volumn 13, Issue 7, 1999, Pages 789-804

  Yi, Sung ^a   Yue, Chee Yoon ^a   Hsieh, Jang Hsing ^a   Fong, Liwha ^a   Lahiri, Syamal K ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

adhesion of molding compounds; oxidation of copper leadframes; Plasma cleaning

Indexed keywords

HEAT TREATMENT TIME; LEAD FRAME; LOAD-DISPLACEMENT CURVE; MOLDING COMPOUND; OXIDE THICKNESS; PLASMA CLEANING; PULL-OUT STRENGTH; PULL-OUT TEST; STICK SLIP MOTION; SURFACE CONTAMINATIONS; THICK OXIDES; WATER CONTACT ANGLE; WATER CONTACT ANGLE MEASUREMENT;

ADHESION; ANGLE MEASUREMENT; BOND STRENGTH (MATERIALS); CLEANING; CONTACT ANGLE; COPPER; HEAT TREATMENT; SHEET MOLDING COMPOUNDS; SLIP FORMING; INTERFACES (MATERIALS); MOLDING; OXIDATION; OXIDES; PLASMA APPLICATIONS; SURFACE CLEANING;

PLASMAS; ADHESION;

COPPER LEADFRAMES; MOLDING COMPOUNDS; PLASMA CLEANING; PULL-OUT TESTS;

EID: 0032659067     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856199X01018     Document Type: Article

References (18)

1. S. Yi, J. S. Goh and J. C. Yang, IEEE Trans. CPMT, Part B 20, 247-255 (1997).
2. S. Yi and K. Y. Sze, ASME Trans. J. Electronic Packaging 120, 385-390 (1998).
3. G. L. Ang, L. C. Goh, K. W. Heng and S. K. Lahiri, in: Proceedings of the 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), pp. 218-221. IEEE, Piscataway, NJ (1995).
4. M. Strobel, C. S. Lyons and K. L. Mittal (Eds), Plasma Surface Modification of Polymers: Relevance to Adhesion. VSP, Zeist, The Netherlands (1994).
5. K. L. Mittal (Ed. ), Polymer Surface Modification: Relevance to Adhesion. VSP, Zeist, The Netherlands (1996).
6. S. Homes and P. Schwartz, Composites Sci. Technol. 38, 1-21 (1990).
7. Z. F. Li and A. N. Netravali, J. Appl. Polym. Sci. 44, 333-346 (1992).
8. D. N. Hild and P. Schwartz, J. Adhesion Sci. Technol. 6, 879-896 (1992).
9. N. Korner, E. Beck, A. Dommann, N. Onda and J. Ramm, Surface Coatings Technol. 76/77, 731-737 (1995).
10. C. Y. Yue and W. L. Cheung, J. Mater. Sci. 27, 3843-3855 (1992).
11. C. Y. Yue and H. C. Looi, J. Mater. Sci. 29, 1901-1909 (1994).
12. J. K. Kim, C. Baillie and Y. W. Mai, J. Mater. Sci. 27, 3143-3154 (1992).
13. L. T. Drzal, Mater. Sci. Eng. A126, 289-293 (1990).
14. J. D. Gright, S. Danchaivijit and D. K. Shetty, J. Am. Ceram. Soc. 74, 155 (1991).
15. T. Young, Trans R. Soc. London 95, 65 (1805).
16. R. J. Good, J. Adhesion Sci. Technol. 6, 1269-1302 (1992).
17. U. R. Evans and H. A. Miley, Nature 139, 238 (1937).
18. K. L. Mittal and H. R. Anderson, Jr. (Eds), Acid-Base Interactions: Relevance to Adhesion Science and Technology. VSP, Zeist, The Netherlands (1991).