Failure analysis of NSOP problem due to Al fluoride oxide on microchip Al bondpads

IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE

Volumn , Issue , 2006, Pages 970-976

  Zhao, Siping ^a,b   Hua, Younan ^b   Ramesh, Rao ^b   Li, Kun ^b  

^a IEEE

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; FAILURE ANALYSIS; MICROPROCESSOR CHIPS; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

ASHING; BONDPADS; MICROCHIPS; OXIDE LAYERS;

SEMICONDUCTING ALUMINUM COMPOUNDS;

EID: 35148865752     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMELEC.2006.380783     Document Type: Conference Paper

References (6)

1. 2 on Microchip Al Bondpads. To be submitted for the 2006 IEEE International Conference on Semiconductor Electronics, 29 NOV-1 DEC, 2006, Kuala Lumpur, Malaysia.
2. Y. N. Hua, Z. R. Guo & K. W. Chau, "Studies of ZAF Standardless EDX Quantification Method and Application in Failure Analysis of Semiconductor," J. Trace and Microprobe Techniques, 15 (1), 13-31 (1997).
3. th Meeting of The Electrochemical Society - Phoenix, Arizone, October 22-27, No. 810 (2000).
4. th International Symposium for Testing & Failure Analysis (ISTFA'2002), 3-7 Nov, Phoenix Civic Plaza, Phoenix, Arizona, USA p495-504 (2002).
5. Hua Younan, Shailesh Redkar, Ron Dickinson and Peh Shirley, A Study on Fluorine-Induced Corrosion on Microchip Aluminium Bondpads. The proceedings from the 29 International Symposium for Testing & Failure Analysis (ISTFA'2003), 2-6 Nov. 2003, Santa Clara, California, USA, p249-255 (2003).
6. Zhao Si Ping, Hua Younan, Rao Ramesh and Li Kun, A Novel Dewing-free shelf lifetime acceleration test (SLAT) in wafer fabrication, patent from Chartered Semiconductor (2006).