Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 1, 1999, Pages 7-15

  Wayne Johnson, R ^a,b   Palmer, Michael J ^b   Bozack, Michael J ^b   Isaacs Smith, Tamara ^b  

^a IEEE   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

THERMOSONIC GOLD WIRE BONDING;

BONDING; ELECTRIC WIRE; PALLADIUM;

ELECTRONICS PACKAGING;

EID: 0033320165     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.755084     Document Type: Article

References (12)

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