Gold - Aluminum intermetallic formation kinetics

IEEE Transactions on Device and Materials Reliability

Volumn 7, Issue 1, 2007, Pages 51-63

  Blish II, Richard C ^b   Li, Susan ^b   Kinoshita, Hiroyuki ^a,b   Morgan, Sheila ^b   Myers, Alline F ^b  

^a IEEE

^b Submicron Development Center   (United States)

Author keywords

Integrated circuit bonding; Integrated circuit packaging; Integrated circuit reliability; Life estimation; Wire

Indexed keywords

ACTIVATION ENERGY; ALUMINUM; DIFFUSION; FILM THICKNESS; GOLD; GRAIN BOUNDARIES; REACTION KINETICS;

INTEGRATED CIRCUIT BONDING; INTEGRATED CIRCUIT PACKAGING; INTEGRATED CIRCUIT RELIABILITY; LIFE ESTIMATION; SUB-FICKIAN EXPONENTS;

INTERMETALLICS;

EID: 34547234488     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2007.891533     Document Type: Conference Paper

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