Rate-dependent properties of Sn-Ag-Cu based lead free solder joints

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 283-291

  Su, Yong'An ^a   Tan, Long Bin ^a   Tan, Vincent B C ^a   Tee, Tong Yan ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b AMKOR TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SOLDER; ELECTRONIC COMPONENT; EUROPEAN UNION; HIGH STRAIN RATES; INTERFACE FAILURE; INTERFACE STRUCTURES; LEAD-FREE SOLDER ALLOY; LEAD-FREE SOLDER JOINT; MATERIAL STRENGTH; MECHANICAL PERFORMANCE; ON-WAFER; OPERATIONAL RELIABILITY; PEAK LOAD; PORTABLE ELECTRONICS; RATE SENSITIVE; REDISTRIBUTION LAYERS; SILICON-BASED; SN-AG-CU; SN-AG-CU ALLOY; SOLDER ALLOYS; SOLDER BUMP; SOLDER JOINTS; SOLDER-JOINT STRENGTH; TENSILE TESTS; TEST RATE; UNDER-BUMP METALLURGIES;

ALLOYS; CHIP SCALE PACKAGES; COPPER ALLOYS; DATA STRUCTURES; LEAD; PACKAGING; SILICON WAFERS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN RATE; TENSILE TESTING; TESTING; TIN ALLOYS;

TIN;

EID: 77950932348     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416537     Document Type: Conference Paper

References (11)

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