Root cause mechanism for delamination/cracking in stacked die chip scale packages

IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Volumn , Issue , 2006, Pages 219-222

  Prack, Edward R ^a   Fan, Xuejun ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; DIES; ELECTRIC CONDUCTIVITY; ELECTRONICS ENGINEERING; FAILURE ANALYSIS; FLIP CHIP DEVICES; HYDROSTATIC PRESSURE; MANUFACTURE; QUALITY ASSURANCE; RELIABILITY; SEMICONDUCTOR MATERIALS; STEEL SHEET; SUBSTRATES; VAPOR PRESSURE;

CHIP-SCALE PACKAGING; COHESIVE FAILURES; DIFFUSIVITY; INTERFACIAL DELAMINATION; INTERNATIONAL SYMPOSIUM; KEY PARAMETERS; MATE RIAL PROPERTIES; MATERIAL CHARACTERIZATIONS; MOISTURE UPTAKE; PACKAGE PERFORMANCE; ROOT CAUSE ANALYSIS; ROOT CAUSES; SEMICONDUCTOR MANUFACTURING; SUBSTRATE THICKNESSES;

CHIP SCALE PACKAGES;

EID: 50249094598     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.2006.4493066     Document Type: Conference Paper

References (4)

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2. E.H. Wong, R. Rajoo, 'Moisture absorption and diffusion characterization of packaging materials-advanced treatment', Microelectronics Reliability 43, pp 2087-2096 (2003)
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4. X.J. Fan, G.Q. Zhang, W.D. van Driel and J. Zhou, 'Modeling and characterization of moisture behavior ', chapter in book by G.Q. Zhang, W.D. van Driel and X.J. Fan 'Mechanics of Microelectronics' Springer (2006)