Direct robust bonding between Sn-based solder and Si substrate

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 10, 2007, Pages 1057-1063

  Yu, D Q ^a,b   Wu, C M L ^a   Wong, Y W ^a   Lai, J K L ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE ANALYSIS; INTERFACIAL STRUCTURE;

BOND STRENGTH (MATERIALS); COMPOSITION EFFECTS; FRACTURE; INTERFACES (MATERIALS); INTERMETALLICS; RARE EARTH ELEMENTS; SEMICONDUCTING SILICON; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS;

SOLDERING;

EID: 34547598309     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9114-3     Document Type: Article

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