In situ TEM study of grain growth in nanocrystalline copper thin films

Nanotechnology

Volumn 21, Issue 14, 2010, Pages

  Simoes, S ^a,b   Calinas, R ^a,c   Vieira, M T ^c   Vieira, M F ^b   Ferreira, P J ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b UNIVERSITY OF PORTO   (Portugal)

^c UNIVERSITY OF COIMBRA   (Portugal)

Author keywords

[No Author keywords available]

Indexed keywords

CU THIN FILM; DC MAGNETRON SPUTTERING; GRAIN SIZE; HIGH ENERGY; HIGH PROBABILITY; HIGH TEMPERATURE; IN-SITU; IN-SITU TEM; MECHANICAL STRENGTH; NANOCRYSTALLINE COPPER; NANOCRYSTALLINE METAL; NANOCRYSTALLINES; TIME EXPONENT; TRANSMISSION ELECTRON MICROSCOPE; TWIN BOUNDARIES;

ACTIVATION ANALYSIS; ACTIVATION ENERGY; COPPER; ELECTRON MICROSCOPES; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GROWTH KINETICS; MECHANICAL PROPERTIES; NANOCRYSTALLINE MATERIALS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

GRAIN GROWTH;

EID: 77949558091     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/21/14/145701     Document Type: Article

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