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Volumn 49, Issue 1, 1997, Pages 33-41
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Recrystallization and grain growth in bulk Cu and Cu(Sn) alloy
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Author keywords
Bimodal grain size distribution; Cu(Sn) alloys; Grain growth
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Indexed keywords
COPPER;
ELECTROMIGRATION;
GRAIN GROWTH;
GRAIN SIZE AND SHAPE;
RECRYSTALLIZATION (METALLURGY);
TIN ALLOYS;
BIMODAL GRAIN SIZE DISTRIBUTION;
COPPER ALLOYS;
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EID: 0031153758
PISSN: 02540584
EISSN: None
Source Type: Journal
DOI: 10.1016/S0254-0584(97)80124-1 Document Type: Article |
Times cited : (23)
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References (18)
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