Grain boundary mobility during recrystallization of copper

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 28, Issue 13, 1997, Pages 749-754

  Vandermeer, R A ^a   Jensen, D Juul ^b   Woldt, E ^c  

^a NAVAL RESEARCH LABORATORY   (United States)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^c TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC MECHANISM; AVERAGE MOBILITY; BOUNDARY MIGRATION; CALORIMETRIC MEASUREMENTS; DEFORMED COPPER; DRIVING FORCES; EXPERIMENTAL ERRORS; GRAIN BOUNDARY MIGRATION RATES; GRAIN-BOUNDARY MOBILITY; HIGHER TEMPERATURES; LINEAR DEPENDENCE; MIGRATION RATES; ORDER OF MAGNITUDE; RATE-CONTROLLING; RECRYSTALLIZATIONS; SELF-DIFFUSIVITY; SINGLE PROCESS; STORED ENERGY OF COLD WORK;

COPPER; GRAIN BOUNDARIES; RECRYSTALLIZATION (METALLURGY); SUGAR (SUCROSE); CALORIMETRY; COLD WORKING; DEFORMATION; MATHEMATICAL MODELS;

GRAIN SIZE AND SHAPE; COPPER METALLOGRAPHY;

ATOMIC MECHANISMS; TURNBULL PROCESS;

EID: 0031100054     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-997-1002-9     Document Type: Article

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