A study of hygrothermal behavior of ACF flip chip packages with Moiréé interferometry

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 1, 2010, Pages 215-221

  Park, Jin Hyoung ^a   Jang, Kyung Woon ^b   Paik, Kyung Wook ^a   Lee, Soon Bok ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Anisotropic conductive film (ACF); Coefficient of moisture expansion (CME); Delamination; Electronic packaging; Moir interferometry; Reliability

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; COEFFICIENT OF MOISTURE EXPANSION; COEFFICIENT OF MOISTURE EXPANSION (CME); DAMAGE MODEL; ELECTRICAL CONTACTS; ELECTRONIC PACKAGING; FLIP CHIP; FLIP-CHIP PACKAGES; GEOMETRIC SIZES; HYGROSCOPIC SWELLING; HYGROTHERMAL BEHAVIOR; INTERFACIAL DELAMINATION; MEASUREMENT RESULTS; MOISTURE DIFFUSION; MOISTURE ENVIRONMENT; PACKAGE FAILURES; PHASE SHIFTING METHODS; PRIMARY FACTORS; RELIABILITY PERFORMANCE; TOTAL LOSS;

ANISOTROPY; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; DELAMINATION; FAILURE ANALYSIS; FLIP CHIP DEVICES; INTERFEROMETRY; MOISTURE; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SHEAR STRAIN; STEEL SHEET; SWELLING;

PACKAGING;

EID: 77949550604     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2036154     Document Type: Article

References (22)

1. A. M. Lyons, E. E. Hall, Y.-H. Wong, G. Adams, "A new approach to using anisotropically conductive adhesives for flip-chip assembly," IEEE Trans. Compon. Packag. Manuf. Technol. A, vol.19, no.1, pp. 5-11, Mar. 1996.
2. J. S. Rasul, "Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications," Microelectron. Reliab., vol.44, no.1, pp. 135-140, 2004.
3. B. Han and P. Kunthong, "Micro-mechanical deformation analysis of surface laminar circuit in organic flip-chip package: An experimental study," J. Electron. Packag., vol.122, no.4, pp. 294-300, 2000.
4. X. Huimin, C. G. Boay, A. Asundi, J. Yu, L. Yunguang, B. K. A. Ngoi, and Z. Zhaowei, "Thermal deformation measurement of electronic package using advanced Moiŕe methods," in Proc. 3rd Electron. Packag. Technol. Conf., 2000, pp. 163-168.
5. M. R. Miller, I. Mohammed, and P. S. Ho, "Quantitative strain analysis of flip-chip electronic packages using phase-shifting Moiŕe interferometry," Optics Lasers Eng., vol.36, no.2, pp. 127-139, 2001.
6. G. Wang, J.-H. Zhao, M. Ding, and P. S. Ho, "Thermal deformation analysis on flip-chip packages using high resolution Moiŕe interferometry," in Proc. 18th Intersoc. Conf. Thermal Thermomech. Phenom. Electron. Syst., 2002, pp. 869-875.
7. D. Post, B. Han, and P. Ifju, High Sensitivity Moiŕe. New York: Springer- Verlag, 1994, p. 118.
8. A. F. Bastawros, A. S. Voloshin, and P. Rodogoveski, "Determination of thermally induced deformations in electronic packages by Moiŕe interferometry," in Proc. 39th Electron. Compon. Technol. Conf. (ECTC), 1989, pp. 864-868.
9. B. Han and Y. Guo, "Determination of an effective coefficient of thermal expansion of electronic packaging components: A whole-field approach," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol.19, no.2, pp. 240-247, Jun. 1996.
10. S. Liu, J. Zhu, D. Zou, and J. Benson, "Study of delaminated plastic packages by high temperature Moiŕe and finite element method," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol.20, no.4, pp. 505- 512, Dec. 1997.
11. Y. Guo and S. Liu, "Development in optical methods for reliability analysis in electronic packaging applications," Am. Soc. Mechan. Eng. J. Electron. Packag., vol.120, no.2, pp. 186-193, 1998.
12. B. Han, Y. Guo, C. K. Lim, and D. Caletka, "Verification of numerical models used in microelectronics packaging design by interferometric displacement measurement methods," Am. Soc. Mechan. Eng. J. Electron. Packag., vol.118, no.3, pp. 157-163, Sep. 1996.
13. L. L. Mercado, "Failure mechanism study of anisotropic conductive film (ACF) packages," IEEE Trans. Compon. Packag. Technol., vol.26, no.3, pp. 509-516, Sep. 2003.
14. W. D. Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, K. S. Chian, and S. Yi, "Prediction and verification of process induced warpage of electronic packages," Microelectron. Reliab., vol.43, no.5, pp. 765-774, May 2003.
15. K. Verma, S. B. Park, and B. Han, "On the design parameters of flipchip PBGA package assembly for optimum solder ball reliability," IEEE Trans. Compon. Packag. Technol., vol.24, no.2, pp. 300-307, Jun. 2001.
16. W. Zhang, D. Wu, B. Su, S. A. Hareb, Y. C. Lee, B. P. Masterson, "The effect of underfill epoxy on warpage in flip-chip assemblies," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol.21, no.2, pp. 323- 329, Jun. 1998.
17. S. Y. Yang and S. B. Lee, "Developing phase-shifting micro-Moiŕe interferometry using phase shifter with rough resolution and by shifting specimen grating," in Proc. Electron. Mater. Packag., Jeju, Korea, Nov. 2001, pp. 399-403.
18. P. Seungbae, "Predictive model for optimized design parameters in flipchip packages and assemblies," IEEE Trans. Compon. Packag. Technol., vol.30, no.2, pp. 294-301, Jun. 2007.
19. X. Q. Shi, "Effect of hygrothermal aging on interfacial reliability of silicon/underfill/FR-4 assembly," IEEE Trans. Compon. Packag. Technol., vol.31, no.1, pp. 94-103, Mar. 2008.
20. X. Q. Shi, "Determination of fracture toughness of underfill/chip interface with digital image speckle correlation technique," IEEE Trans. Compon. Packag. Technol., vol.30, no.1, pp. 101-109, Mar. 2007.
21. M. J. Yim and K. W. Paik, "The contact resistance and reliability of anisotropically conductive film (ACF)," IEEE Trans. Adv. Packag., vol.22, no.2, pp. 166-173, May 1999.
22. X. J. Fan, H. B. Wang, and T. B. Lim, "Investigation of the underfill delamination and cracking for flip-chip module during thermal cyclic loading," IEEE Trans. Compon., Packag., Manufact. Technol., vol.24, no.1, pp. 84-91, Mar. 2001.