Determination of fracture toughness of underfill/chip interface with digital image speckle correlation technique

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 1, 2007, Pages 101-109

  Shi, X Q ^a   Zhang, Y L ^b   Zhou, W ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Digital image correlation; Finite element (FE); Fractograph; Fracture toughness; Interface delamination

Indexed keywords

FINITE ELEMENT METHOD; FRACTOGRAPHY; FRACTURE MECHANICS; FRACTURE TOUGHNESS; IMAGE PROCESSING; INTERFACES (MATERIALS); SPECKLE;

DIGITAL IMAGE SPECKLE CORRELATION TECHNIQUE; POLYMER/INORGANIC INTERFACE; UNDERFILL/CHIP JOINT;

FLIP CHIP DEVICES;

EID: 34247173615     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.892082     Document Type: Article

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