Study of delaminated plastic packages by high temperature moiré and finite element method

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 4, 1997, Pages 505-511

  Liu, Sheng ^a,b   Zhu, Jiansen ^b   Zou, Daqing ^b   Benson, Jim ^c  

^a IEEE   (United States)

^b Wayne State University   (United States)

^c INTERSIL CORPORATION   (United States)

Author keywords

Power small outline plastic package; Thin quad flatpack plastic package

Indexed keywords

COMPUTER SIMULATION; COOLING; COST EFFECTIVENESS; DELAMINATION; FINITE ELEMENT METHOD; INTERFEROMETRY; MOIRE FRINGES; PLASTIC PRODUCTS;

POWER SMALL OUTLINE PLASTIC PACKAGE (PSOPP); THIN QUAD FLATPACK PLASTIC PACKAGE (TQFPP);

ELECTRONICS PACKAGING;

EID: 0031375690     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.650941     Document Type: Article

References (21)

1. S. Liu and Y. H. Mei, "Behaviors of delaminated plastic ic packages subjected to encapsulation cooling, moisture absorption and wave soldering," IEEE Trans. Comp., Hybrids. Manufact. Technol., vol. 18, pp. 634-645, Sept. 1995.
2. _, "An investigation to popcorning mechanisms for IC plastic packages: EMC cracking," Int. J. Microcirc. Electron. Packag., no. 3, Dec. 1997.
3. Y. Guo, C. K. Lim, W. T. Chen, and C. G. Woychik, "Solder ball connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry and its interpretation," IBM J. Res. Develop., vol. 37, no. 5, pp. 635-647, Sept. 1993.
4. Y. Guo and C. K. Lim, "Hybrid method for strain/stress analysis in electronic packaging using moiré interferometry and FEM," in Proc. SEM Spring Conf., Baltimore, MD, June 6-8, 1994.
5. Y. Guo, "Experimental determination of effective coefficients of thermal expansion in electronic packaging," in Proc. ASME Int. Intersoc. Electron. Packag. Conf. Exhibition, Lahaina, HI, Mar. 26-30, 1995.
6. _, "Experimental determination of effective coefficients of thermal expansion in electronic packaging," in Proc. ASME Int. Intersoc. Electron. Packag. Conf. Exhibition, Lahaina, HI, Mar. 26-30, 1995.
7. B. Han, Y. Guo, and C. K. Lim, "Application of interferometric techniques to verification of numerical model for microelectronics packaging design," in Proc. ASME Int. Intersoc. Electron. Packag. Conf. Exhibition, Lahaina, HI, Mar. 26-30, 1995.
8. J. S. Zhu, "Modeling and validation of thermally-induced failure mechanisms in microelectronic packaging," Ph.D. dissertation, Mech. Eng. Dept., Wayne State Univ., Detroit, MI, 1996.
9. J. S. Zhu, D. Q. Zou, F. L. Dai, S. Liu, and Y. Guo, "High temperature deformation analysis of high density interconnects and packages by high density moiré interferometry," in Proc. SEM's VIII Int. Congr. Experimental Mech., Experimental/Numerical Mech. Electron. Packag., Nashville, TN, June 10-12, 1996.
10. J. S. Zhu, D. Q. Zou, F. L. Dai, and S. Liu, "High temperature deformation analysis of a flip-chip assembly by moiré interferometry," in Proc. 19th Int. Electron. Manufact. Technol. Symp., Austin, TX, Oct. 14-16, 1996.
11. J. S. Zhu, D. Q. Zou, S. Liu, and J. Benson, "Thermal behavior study of power plastic package by high temperature moiré interferometry and FEA modeling," in Proc. Int. Mech. Eng. Congr. Exposition, Struc. Anal. Microelectron. Fiber Opt., Atlanta, GA, Nov. 17-22, 1996, vol. EEP-16, pp. 141-148.
12. J. S. Zhu, D. Zou, F. Dai, S. Liu, and Y. F. Guo, "High temperature deformation of area array packages by moiré interferometry/FEM hybrid method," in Proc. 3rd VLSI Packag. Workshop Jpn., Kyoto, Japan, Dec. 2-4, 1996.
13. J. S. Zhu, D. Q. Zou, F. L. Dai, and S. Liu, "High temperature deformation analysis of high density interconnects and packages by high density moiré interferometry," Experimental/Num. Mech. Electron. Packag. (E/NMEP), vol. 1, 1997.
14. J. S. Zhu, S. Liu, and W. Yang, "Thermal deformation and stress analysis of a column grid array package by hybrid moiré/ FEM Min ethod," in Proc. 9th Symp. Mech. Surface Mount Assemblies, Int. Mech. Eng. Congr., Dallas, TX, Nov. 16-21, 1997.
15. J. S. Zhu, D. Q. Zou, and S. Liu, "Real time monitoring and simulations of thermal deformations in plastic package," in Int. Mech. Eng. Congr., Dallas, TX, Nov. 16-21, 1997.
16. J. C. Suhling and S. T. Lin, "Applications of optical methods to electronic packaging," ASME AWM 1995, pp. 109-114.
17. Y. Guo and S. Liu, "Development in optical measurements for electronic packaging materials and structures," in Proc. Symp. Experimental/Numer. Mech. Electron. Packag., Soc. Experimental Mech., Seattle, WA, June 1997.
18. X. Y. He, D. Q. Zou, S. Liu, and Y. Guo, "A window based graphics interface for phase shifting analysis in moiré interferometry," in Proc. Symp. Applications Experimental Electron. Packag., Int. Mech. Eng. Congr., Dallas, TX, Nov. 16-21, 1997.
19. D. Q. Zou, X. Y. He, S. Liu, Y. Guo, and F. L. Dai, "Resolving deformation near comers and interfaces by phase shifting moiré interferometry," in Proc. Symp. Appl. Experimental Electron. Packag., Int. Mech. Eng. Congr., Dallas, TX, Nov. 16-21, 1997.
20. D. Post, B. Han, and P. Ifju, High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials. New York: Springer-Verlag, 1993.
21. CINDAS Database, SRC Rep., 1997.