Thermal deformation analysis on flip-chip packages using high resolution moiré interferometry

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 869-875

  Wang, Guotao ^a   Zhao, Jie Hua ^b   Ding, Min ^a   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b MOTOROLA INC   (United States)

Author keywords

Delamination; Phase shift; Solder reliability; Thermal stress

Indexed keywords

CHIP SCALE PACKAGES; DEFORMATION; DELAMINATION; DIES; INTERFEROMETRY; PHASE SHIFT; SHEAR STRESS; SILICON; SOLDERING ALLOYS; THERMAL CYCLING;

THERMAL DEFORMATION;

FLIP CHIP DEVICES;

EID: 0036457971     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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