Local conductivity and electric field analysis of Ag-based conductive adhesive by transmission electron microscopy

Journal of Applied Physics

Volumn 107, Issue 4, 2010, Pages

  Kawamoto, N ^a   Murakami, Y ^a   Shindo, D ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTION MECHANISM; CONDUCTION PROPERTIES; CONDUCTIVE ADHESIVE; ELECTRIC FIELD ANALYSIS; EQUIPOTENTIAL LINES; IN-SITU OBSERVATIONS; INHOMOGENEOUS DISTRIBUTION; INTERNAL STRUCTURE; LOCAL SHAPE; MICRO-PROBES; MORPHOLOGICAL CHANGES; PB FREE SOLDERS; TEM; TEM OBSERVATIONS;

AGGLOMERATION; ELECTRIC FIELDS; ELECTRIC PROPERTIES; ELECTRON HOLOGRAPHY; LEAD; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

SILVER;

EID: 77749283491     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3305637     Document Type: Article

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