SCOPUS 정보 검색 플랫폼

Volumn 70, Issue 4, 2006, Pages 384-388

Advanced transmission electron microscopy on silver-based conductive adhesive

Author keywords

Lead free soldering; Packaging materials; Silver based conductive paste; Transmission electron microscopy

Indexed keywords

CONDUCTIVE ADHESIVES; LEAD-FREE SOLDERING; SILVER-BASED CONDUCTIVE PASTE;

ADHESIVES; PACKAGING MATERIALS; SILVER; SOLDERING;

TRANSMISSION ELECTRON MICROSCOPY;

ADHESIVES; PACKAGING MATERIALS; SILVER; TRANSMISSION ELECTRON MICROSCOPY;

EID: 33744796947 PISSN: 00214876 EISSN: None Source Type: Journal
DOI: 10.2320/jinstmet.70.384 Document Type: Article

Times cited : (6)

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