Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder

6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Volumn , Issue , 2007, Pages 101-104

  Kawamoto, N ^a   Murakami, Y ^a   Shindo, D ^a   Suganuma, K ^b  

^a TOHOKU UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Conductive adhesive; Electronic packaging; Fine particle; Microprobe; Transmission electron microscopy

Indexed keywords

ADHESIVES; AGGLOMERATION; ELECTRONICS INDUSTRY; LEAD; MICROELECTRONICS; MICROSTRUCTURE; PAINTING; PHOTONICS; POLYMERS; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

AG PARTICLES; CONDUCTION PATHS; CONDUCTIVE ADHESIVE; CONDUCTIVE ADHESIVES; CONDUCTIVITY ANALYSIS; ELECTRIC RESISTIVITY; ELECTRON MICROSCOPY.; ELECTRONIC PACKAGING; FINE PARTICLE; MICRO-PROBES; MICROPROBE; PB-FREE SOLDERS; TRANSMISSION ELECTRON MICROSCOPE;

SILVER;

EID: 49949103996     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2007.4339147     Document Type: Conference Paper

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