How to affect number, size, and location of metal particles deposited in conducting polymer layers

Journal of Solid State Electrochemistry

Volumn 12, Issue 11, 2008, Pages 1421-1434

  Tsakova, V ^a  

^a INSTITUTE OF PHYSICAL CHEMISTRY   (Bulgaria)

Author keywords

Ag; Conducting polymers; Cu; Electroless precipitation; Metal electrodeposition

Indexed keywords

AG; ANION COMPLEXES; BULK STRUCTURES; CONDUCTING POLYMER (CP); CU; DIPPING TIME; ELECTROLESS METAL; ELECTROLESS PRECIPITATION; INITIAL OXIDATION; METAL CATIONS; METAL CRYSTALS; METAL DEPOSITS; METAL ELECTROCRYSTALLIZATION; METAL ELECTRODEPOSITION; METAL PARTICLES; PLATING SOLUTIONS; POLYMER LAYERS; POLYMER SURFACES;

CHLORINE COMPOUNDS; CONCENTRATION (PROCESS); CONDUCTING POLYMERS; CONDUCTIVE PLASTICS; COPPER PLATING; CRYSTAL GROWTH; CRYSTALLOGRAPHY; ELECTROLESS PLATING; MAGNETIC TAPE; METALS; ORE DEPOSIT GEOLOGY; ORGANIC CONDUCTORS; POLYMERS; SURFACE CHARGE; SURFACE STRUCTURE;

PRECIPITATION (CHEMICAL);

EID: 50649107017     PISSN: 14328488     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10008-007-0494-y     Document Type: Article

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