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Volumn 517, Issue 14, 2009, Pages 4222-4225
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Low energy O2+ and N2O+ ion beam modification of polyimide for improving adhesive strength of Cu/PI in roll-to-roll process
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Author keywords
Copper on polyimide; Ion beam; Linear stationary plasma thruster; Peel strength
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Indexed keywords
[CARBONYL;
ADHESIVE STRENGTHS;
BEAM ENERGIES;
BEAM IRRADIATIONS;
COPPER LAYERS;
DOUBLE BONDS;
IN-SITU;
IN-SITU DEPOSITIONS;
ION BEAM MODIFICATIONS;
ION FLUENCE;
ION-BEAM TREATMENTS;
LINEAR STATIONARY PLASMA THRUSTER;
LOW ENERGIES;
MECHANICAL DURABILITIES;
PEEL STRENGTH;
PI FILMS;
POLAR FORCES;
POLY-IMIDE FILMS;
REACTIVE IONS;
ROLL-TO-ROLL PROCESS;
SURFACE ENERGIES;
SURFACE MODIFICATIONS;
WINDING SPEED;
BEAM PLASMA INTERACTIONS;
CHEMICAL MODIFICATION;
COPPER;
ION BEAMS;
ION BOMBARDMENT;
ION SOURCES;
PLASMA DEVICES;
PLASMA FLOW;
PLASMA THEORY;
POLYIMIDES;
POLYMERS;
SURFACE CHEMISTRY;
SURFACE TENSION;
WINDING;
IONS;
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EID: 65449140851
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2009.02.041 Document Type: Article |
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Times cited : (8)
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References (11)
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