Improvement of copper plating adhesion of PPE printed wiring board by plasma treatment

Surface and Coatings Technology

Volumn 202, Issue 22-23, 2008, Pages 5583-5585

  Ikari, Shohei ^a   Kashiwade, Hiroshi ^a   Matsuoka, Takashi ^a   Hirayama, Tomoko ^a   Ishida, Shuiti ^a   Kato, Kiyotaka ^b  

^a DOSHISHA UNIVERSITY   (Japan)

^b KTECH Research Corporation   (Japan)

Author keywords

Adhesion; Copper plating; Plasma treatment; Polyphenylene ether; Printed wiring board

Indexed keywords

ADHESION; ARGON; COPPER; COPPER PLATING; ELECTROPLATING; ETCHING; FUNCTIONAL GROUPS; INERT GASES; NONMETALS; OXYGEN; PLASMA APPLICATIONS; PLASMA ETCHING; PLASMAS; PLATING; PRINTED CIRCUIT BOARDS; SURFACE MORPHOLOGY; SURFACE ROUGHNESS;

CARBON TETRA FLUORIDE; PEEL STRENGTH; PLASMA TREATMENT; PLASMA TREATMENTS; POLYPHENYLENE ETHER; PRINTED WIRING BOARD;

SURFACE TREATMENT;

EID: 50349093914     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2008.06.032     Document Type: Article

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