Surface finishes of rolled copper foil for flexible printed circuit board

Materials Science and Engineering: A

Volumn 483-484, Issue 1-2 C, 2008, Pages 723-726

  Lee, Chang Yong ^a   Moon, Won Chul ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Fracture surface; Oxidation treatment; Peel strength; Rolled copper foil

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; FINISHING; FRACTURE; MORPHOLOGY; STRENGTH OF MATERIALS; X RAY PHOTOELECTRON SPECTROSCOPY;

OXIDIZED SURFACE; PEEL STRENGTH; ROLLED COPPER FOIL;

PRINTED CIRCUIT BOARDS;

ENERGY DISPERSIVE SPECTROSCOPY; FINISHING; FRACTURE; MORPHOLOGY; PRINTED CIRCUIT BOARDS; STRENGTH OF MATERIALS; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 41849096400     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.176     Document Type: Article

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