Plasma enhanced chemical vapor deposition of porous organosilicate glass ILD films with κ ≤ 2.4.

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 259-264

  Vrtis, Raymond N ^a   O'Neill, Mark L ^a   Vincent, Jean L ^a   Lukas, Aaron S ^a   Peterson, Brian K ^a   Bitner, Mark D ^a   Karwacki, Eugene J ^a  

^a AIR PRODUCTS AND CHEMICALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; HARDNESS; NANOSTRUCTURED MATERIALS; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POROUS MATERIALS; SEMICONDUCTING GLASS; SILANES; SILICATES; STRENGTH OF MATERIALS;

DIETHOXYMETHYLSILANE; NANOPOROUS ORGANOSILICATE FILM; POROUS ORGANOSILICATE GLASS;

DIELECTRIC FILMS;

EID: 0348199056     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-766-e7.4     Document Type: Conference Paper

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