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Journal of Applied Electrochemistry

Volumn 39, Issue 10, 2009, Pages 1719-1724

An investigation of phosphate based ECMP electrolyte performance on feature scale planarization

(2) Shattuck, Kristin G a West, Alan C a

a Department of Earth and Environmental Sciences (United States)

Author keywords

BTA; Copper; ECMP; Planarization; Potassium phosphate

Indexed keywords

AG/AGCL; ALTERNATIVE METHODS; APPLIED VOLTAGES; BENZOTRIAZOLES; CMP PROCESS; CONCENTRATION OF; COPPER CHEMICAL MECHANICAL PLANARIZATION; ECMP; ELECTROCHEMICAL MECHANICAL PLANARIZATION; FEATURE SIZES; INDUSTRIAL STANDARDS; METAL THICKNESS; NEW MATERIAL; PH VALUE; PLANARIZATION; PLANARIZATION CAPABILITY; POLISHING PADS; POTASSIUM PHOSPHATE; STEP HEIGHT;

CHEMICAL MECHANICAL POLISHING; COPPER; ELECTROLYSIS; NANOTECHNOLOGY; PHOSPHATES; POLISHING; STRUCTURES (BUILT OBJECTS);

ELECTROLYTES;

EID: 73149085272 PISSN: 0021891X EISSN: None Source Type: Journal
DOI: 10.1007/s10800-009-9865-7 Document Type: Article

Times cited : (8)

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