Effects of Ag on microstructures, wettabilities of Sn-9Zn-xAg solders as well as mechanical properties of soldered joints

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 5, 2010, Pages 461-467

  Chen, Wen Xue ^a   Xue, Song Bai ^a   Wang, Hui ^a   Wang, Jian Xin ^a   Han, Zong Jie ^a   Gao, Li Li ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS;

FRACTURE; LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; ZINC;

TIN;

EID: 77953322375     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9939-7     Document Type: Article

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