SCOPUS 정보 검색 플랫폼

Volumn 38, Issue 12, 2009, Pages 2647-2658

Effect of electromigration and isothermal aging on the formation of metal whiskers and hillocks in eutectic Sn-Bi solder joints and reaction films

(6) Guo, Fu a Xu, Guangchen a,b He, Hongwen a Zhao, Mengke a Sun, Jia a Wang, C Henry c

a BEIJING UNIVERSITY OF TECHNOLOGY (China)

b Michigan State University (United States)

c HENKEL CORPORATION (United States)

Author keywords

Electromigration; Isothermal aging; Metal hillock; Metal whisker

Indexed keywords

AMBIENT TEMPERATURES; CIRCUIT ELEMENTS; CU ATOMS; CU SUBSTRATE; DRIVING FORCES; ELECTRONIC SOLDERS; ELECTRONIC SYSTEMS; HIGH CURRENT DENSITIES; INTERCONNECT MATERIALS; ISOTHERMAL AGING; MULTIPHASE MATERIALS; REACTION FILMS; SECONDARY DIFFUSION; SHORT CIRCUIT; SOLDER JOINTS;

ATOMS; CHEMICAL REACTIONS; COPPER; ELECTRIC FIELDS; ELECTROMIGRATION; EUTECTICS; METALS; SOLDERING ALLOYS; SYSTEMS ENGINEERING;

TIN;

EID: 72549112064 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0910-4 Document Type: Article

Times cited : (16)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.