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Volumn 38, Issue 12, 2009, Pages 2455-2460

Interfacial adhesion characteristics between electroless-plated Ni and polyimide films modified by alkali surface pretreatment

(5) Min, Kyoung Jin a Park, Sung Cheol a Lee, Kyu Hwan b Jeong, Yongsoo b Park, Young Bae a

a Andong National University (South Korea)

b Korea Institute of Material Science (South Korea)

Author keywords

Adhesion; Electroless plated Ni; Peel test; Polyimide; Wet chemical pretreatment

Indexed keywords

ELECTROLESS-PLATED NI; PEEL TEST; PEEL TESTS; WET CHEMICAL PRETREATMENT; WET CHEMICALS;

ALKALINITY; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; CHEMICAL BONDS; EMISSION SPECTROSCOPY; INTERFACIAL ENERGY; NICKEL; PEELING; POLYIMIDES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE;

ADHESION;

EID: 72549084331 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0937-6 Document Type: Article

Times cited : (19)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.