Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage

Journal of Adhesion Science and Technology

Volumn 16, Issue 8, 2002, Pages 1027-1040

  Wang, Zenglin ^a   Furuya, Akihiko ^a   Yasuda, Keiichirou ^a   Ikeda, Hideo ^a   Baba, Tomoyuki ^a   Hagiwara, Muneaki ^a   Toki, Sotaro ^a   Shingubara, Shoso ^a   Kubota, Hiroshi ^a   Ohmi, Tadahiro ^a  

^a HIROSHIMA UNIVERSITY   (Japan)

Author keywords

Adhesion strength; Copper carboxylate; Electroless copper plating; Imide ring cleavage; Polyimide film; Surface microroughness

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; COPPER PLATING; ELECTROLESS PLATING; METALLIC FILMS; POLYIMIDES; POTASSIUM COMPOUNDS; SURFACE ROUGHNESS; SURFACE TREATMENT; ADHESION; AMIDES; BOND STRENGTH (MATERIALS); CARBOXYLATION; POLYMERIC FILMS;

SURFACE MICROROUGHNESS;

ADHESION; COPPER;

COPPER CARBOXYLATE; ELECTROLESS COPPER PLATING; POLYIMIDE FILM; RING CLEAVAGE; SURFACE MICROROUGHNESS;

EID: 18444370839     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856102760146147     Document Type: Article

References (20)