Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS

Applied Surface Science

Volumn 205, Issue 1-4, 2002, Pages 128-136

  Lee, Won Jun ^a   Lee, Youn Seoung ^b   Rha, Sa Kyun ^b   Lee, Yoon Jik ^c   Lim, Kwan Yong ^c   Chung, Yong Duck ^d   Whang, Chung Nam ^d  

^a Sejong University   (South Korea)

^b Hanbat National University   (South Korea)

^c Hynix Semiconductor Inc   (South Korea)

^d Yonsei University   (South Korea)

Author keywords

Interface; Polyimide; X ray photoelectron spectroscopy

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; COMPLEXATION; COPPER; INTERFACES (MATERIALS); TITANIUM NITRIDE; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERFACE CHEMICAL REACTIONS;

POLYIMIDES;

EID: 0037204384     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(02)01016-4     Document Type: Article

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