Cohesive failure of the Cu/polyimide system

Materials Science and Engineering: A

Volumn 282, Issue 1-2, 2000, Pages 137-144

  Park, I S ^a   Ahn, E C ^b   Yu, Jin ^c   Lee, H Y ^c  

^a H ^*  (South Korea)

^b Semiconduct M   (South Korea)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Cohesive failure; CuCr alloy; Depth profiling; Metal polymer interface

Indexed keywords

CHROMIUM; COPPER; COPPER ALLOYS; FAILURE ANALYSIS; INTERFACIAL ENERGY; METALLIC FILMS; PEELING; PLASMA APPLICATIONS; POLYIMIDES; STRENGTH OF MATERIALS; STRIP METAL;

COHESIVE FAILURE; COPPER CHROMIUM ALLOYS; DEPTH PROFILING;

METALLIC MATRIX COMPOSITES;

EID: 0002367911     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(99)00763-7     Document Type: Article

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