Effects of titania content and plasma treatment on the interfacial adhesion mechanism of nano titania-hybridized polyimide and copper system

Polymer

Volumn 45, Issue 13, 2004, Pages 4465-4472

  Chiang, Pei Chun ^a   Whang, Wha Tzong ^a   Wu, Sheng Chang ^b   Chuang, Kuen Ru ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b Taimide Technology Company   (Taiwan)

Author keywords

Plasma treatment; Polyimide; Titania

Indexed keywords

ADHESION; COPPER; INTERFACES (MATERIALS); PLASMA APPLICATIONS; SURFACE TREATMENT; TITANIUM DIOXIDE;

ADHESION STRENGTH; COPPER SYSTEMS; PLASMA TREATMENT;

POLYIMIDES;

ARGININE; COPPER; NITRITE; OXYGEN; POLYIMIDE; TITANIUM DIOXIDE;

ADHESION; ARTICLE; ATOMIC FORCE MICROSCOPY; CONTACT ANGLE; FILM; HYBRID; MOLECULAR MECHANICS; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY; X RAY PHOTOELECTRON SPECTROSCOPY;

POLYMER SCIENCE;

EID: 2542489376     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2004.04.024     Document Type: Article

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