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Volumn 157, Issue 1, 2010, Pages

Materials engineering for future interconnects: "catalyst-free" electroless Cu deposition on self-assembled monolayer alternative barriers

(2) Armini, S a Maestre Caro, A a,b

a IMEC (Belgium)

b UNIVERSITY OF LEUVEN (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

3-AMINOPROPYL TRIMETHOXYSILANE; CATALYST MATERIAL; CATALYST-FREE; CU DEPOSITION; CU ELECTROLESS DEPOSITION; CU IONS; DEPOSITION PARAMETERS; DEPOSITION SUBSTRATES; DESIGN OF THE EXPERIMENT; DIMETHYLAMINE BORANE; ELECTROLESS; FORMING GAS; FUNCTIONALIZED; INTERFACIAL COMPLEXES; ION CONCENTRATIONS; MATERIALS ENGINEERING; NEUTRAL PH; OPPOSITE CHARGE; PARTICLE SURFACE; POSITIVELY CHARGED; WETTING BEHAVIOR;

ACTIVATION ENERGY; CATALYSIS; CATALYSTS; FLUORINE CONTAINING POLYMERS; GAS PERMEABLE MEMBRANES; HEAVY IONS; INTERFACIAL ENERGY; IONIC STRENGTH; REDUCING AGENTS; SELF ASSEMBLED MONOLAYERS; SURFACE ROUGHNESS; SURFACES;

COPPER;

EID: 72249099688 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3258026 Document Type: Article

Times cited : (17)

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