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Volumn 157, Issue 1, 2010, Pages

Characterization of nanometer-scale gap formation

Author keywords

[No Author keywords available]

Indexed keywords

ETCH RATES; FABRICATION PROCESS; GAP FORMATION; GAP SIZE; LATERAL ETCHING; NANO-METER-SCALE; NANOELECTRONIC DEVICES; NANOGAPS; NANOMETER-SCALE GAPS; POLYCRYSTALLINE; POSTDEPOSITION THERMAL ANNEALING; SACRIFICIAL LAYER; SI WAFER; STRUCTURAL LAYERS; ULTRA-SMALL;

EID: 72249084554     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3253546     Document Type: Article
Times cited : (1)

References (16)
  • 11
    • 21944444119 scopus 로고    scopus 로고
    • Lateral etching and filling of high aspect ratio nanometer-size cavities for silicon device structures
    • DOI 10.1063/1.122639, PII S0003695198013461
    • C. A. King, Y. O. Kim, and K. K. Ng, Appl. Phys. Lett., 73, 2947 (1998). 10.1063/1.122639 (Pubitemid 128674195)
    • (1998) Applied Physics Letters , vol.73 , Issue.20 , pp. 2947-2949
    • King, C.A.1    Kim, Y.O.2    Ng, K.K.3
  • 12
    • 34548193292 scopus 로고
    • 10.1103/PhysRev.17.273
    • E. W. Washburn, Phys. Rev., 17, 273 (1921). 10.1103/PhysRev.17.273
    • (1921) Phys. Rev. , vol.17 , pp. 273
    • Washburn, E.W.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.