Enhanced light extraction in wafer-bonded AlGaInP-based light-emitting diodes via micro- and nanoscale surface textured

IEEE Electron Device Letters

Volumn 30, Issue 10, 2009, Pages 1054-1056

  Lee, Yea Chen ^a   Kuo, Hao Chung ^a   Cheng, Bo Siao ^a   Lee, Chia En ^a   Chiu, Ching Hua ^a   Lu, Tien Chang ^a   Wang, Shing Chung ^a   Liao, Tien Fu ^b   Chang, Chih Sung ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b High Power Opto Inc   (Taiwan)

Author keywords

AlGaInp light emitting diodes (LEDs); Lightextraction efficiency; Metal bonding; Silica nanoparticles; Spin coating; Surface textured

Indexed keywords

ALGAINP; ALGAINP-BASED LIGHT-EMITTING DIODES; CURRENT INJECTIONS; DEVICE SURFACES; LIGHT EXTRACTION; LIGHT-EXTRACTION EFFICIENCY; LUMINOUS INTENSITY; METAL BONDING; NANO SCALE; NANO-SCALE SURFACES; PLANE SURFACES; SILICA NANOPARTICLES; TEXTURED SURFACE; WALLPLUG EFFICIENCY;

COATINGS; CURRENT DENSITY; DIODES; ETCHING; LIGHT EMISSION; METAL RECOVERY; NANOPARTICLES; NANORODS; NANOSTRUCTURED MATERIALS; SILICA; SPIN DYNAMICS;

LIGHT EMITTING DIODES;

EID: 72049125340     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2009.2028445     Document Type: Article

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