Characterization of electroplated bismuth-tin alloys for electrically conducting materials

Journal of Electronic Materials

Volumn 29, Issue 10, 2000, Pages 1278-1283

  Kang, S K ^a   Buchwalter, S ^a   Tsang, C ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BISMUTH ALLOYS; CONDUCTIVE MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; ELECTROPLATING; METALLOGRAPHIC MICROSTRUCTURE; OXIDATION;

CONDUCTIVE ADHESIVES;

SOLDERING ALLOYS;

EID: 0034297698     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0025-4     Document Type: Article

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