Chip-on-board packaging and thermal solutions for 100W single large area LED

International Conference and Exhibition on Device Packaging 2009

Volumn 4, Issue , 2008, Pages 2195-2229

  Liu, Jay G ^a   Xiong, Daxi ^a   Panaccione, Paul ^a  

^a Luminus Devices Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP ON BOARDS; FRONT PROJECTOR; HEAT SPREADING; HIGH CURRENTS; HIGH THERMAL CONDUCTIVITY; INSULATED METAL SUBSTRATES; THERMAL PATHS; THERMAL SOLUTION;

CHIP SCALE PACKAGES; EXHIBITIONS; INTERFACES (MATERIALS); PACKAGING;

THERMAL CONDUCTIVITY;

EID: 84877758806     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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