A study on the effect of epoxy molding compound (EMC) rheology during encapsulation of stacked-CHIP scale packages (S-CSP)

Journal of Reinforced Plastics and Composites

Volumn 28, Issue 20, 2009, Pages 2527-2538

  Abdullah, M Khalil ^a   Abdullah, M Z ^a   Mujeebu, M A ^a   Kamaruddin, S ^a   Ariff, Z M ^a  

^a SCHOOL OF CHEMICAL ENGINEERING   (Malaysia)

Author keywords

Castrog Macosko model; Cross model.; Finite difference method (FDM); Stacked chip scale package (S CSP)

Indexed keywords

CASTROG-MACOSKO MODEL; CROSS MODEL.; DIE AND MOLD; DIE STACKING; ELECTRONIC INDUSTRIES; EPOXY MOLDING COMPOUNDS; EXPERIMENTAL INVESTIGATIONS; FLOW ANALYSIS; FLOW RETARDATION; FREE REGION; GAP CLEARANCE; GAP REGIONS; HITACHI; MOLD CAVITIES; MOLD FILLING; MOLD FLOW; NON-NEWTONIAN; NONISOTHERMAL; ON FLOW; POLYMER RHEOLOGY; SIMULATION RESULT; STACKED-CHIP SCALE PACKAGE (S-CSP); STOKES EQUATIONS; WIRE BONDS;

COMPUTER OPERATING PROCEDURES; CURING; DIES; DIFFERENCE EQUATIONS; DROP FORMATION; ELASTICITY; ELECTROMAGNETIC COMPATIBILITY; ELECTRONIC EQUIPMENT MANUFACTURE; FINITE DIFFERENCE METHOD; FREQUENCY DIVISION MULTIPLEXING; MOLDING; NON NEWTONIAN FLOW; PLASTIC MOLDS; PLASTICITY; RHEOLOGY; SHEET MOLDING COMPOUNDS; SIMULATORS; THREE DIMENSIONAL; VISCOSITY;

CHIP SCALE PACKAGES;

EID: 70350108854     PISSN: 07316844     EISSN: 15307964     Source Type: Journal    
DOI: 10.1177/0731684408092409     Document Type: Article

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