Prediction of wire sweep during the encapsulation of IC packaging with wire density effect

Journal of Electronic Packaging

Volumn 127, Issue 3, 2005, Pages 335-339

  Pei, Chien Chang ^b   Hwang, Sheng Jye ^a,b  

^a ASME   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Mold Filling Analysis; Plastic Encapsulation; Plastic Packaging of ICs; Transfer Molding; Wire Density Effect; Wire Sweep

Indexed keywords

COMPUTER SIMULATION; DENSITY (SPECIFIC GRAVITY); INTEGRATED CIRCUITS; MATHEMATICAL MODELS; PLASTIC MOLDS; WIRE;

MOLD-FILLING ANALYSIS; PLASTIC ENCAPSULATION; PLASTIC PACKAGING OF ICS; WIRE DENSITY EFFECT; WIRE SWEEP;

ELECTRONICS PACKAGING;

EID: 26844541996     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1939028     Document Type: Article

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