On the dynamics of air-trap in the encapsulation process of microelectronics package

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 2, Issue , 1998, Pages 1178-1182

  Chang, Rong Yeu ^a   Yang, Wen Sheng ^a   Chen, Eugen ^a   Lin, Chris ^a   Hsu, Chia Hsiang ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED ENGINEERING; COMPUTER SIMULATION; ENCAPSULATION; EPOXY RESINS; FLOW PATTERNS; HEAT TRANSFER; MICROELECTRONIC PROCESSING; NON NEWTONIAN FLOW; PLASTICS MOLDING;

AIR TRAP DYNAMICS; EPOXY MOLDING COMPOUNDS; PLASTIC ENCAPSULATED MICROELECTRONICS;

ELECTRONICS PACKAGING;

EID: 0031680387     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)