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Volumn 10-1, Issue , 1995, Pages 73-78
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Flow analysis in a cavity with leadframe during semiconductor chip encapsulation
a
a
Cornell Univ
*
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
CAVITY WITH LEADFRAME;
CONTINUITY EQUATIONS;
FLOW ANALYSIS;
SEMICONDUCTOR CHIP ENCAPSULATION;
APPROXIMATION THEORY;
BOUNDARY CONDITIONS;
COMPUTER SIMULATION;
ELECTRONICS PACKAGING;
ENCAPSULATION;
FLOW VISUALIZATION;
NEWTONIAN LIQUIDS;
PLASTIC FLOW;
SHEET MOLDING COMPOUNDS;
MICROPROCESSOR CHIPS;
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EID: 0029227896
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (10)
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References (11)
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