Numerical simulation of underfill encapsulation process based on characteristic split method

International Journal for Numerical Methods in Engineering

Volumn 66, Issue 10, 2006, Pages 1658-1671

  Kulkarni, Venkatesh M ^a   Seetharamu, K N ^b   Abdul Azid, Ishak ^a   Aswatha Narayana, P A ^b   Abdul Quadir, Ghulam ^c  

^a SCHOOL OF CHEMICAL ENGINEERING   (Malaysia)

^b M S RAMAIAH UNIVERSITY OF APPLIED SCIENCES   (India)

^c Al Falah School of Engineering and Technology   (India)

Author keywords

Characteristic based split (CBS) method; Finite element method (FEM); Front tracking; Simulation; Underfill encapsulation; Volume of Fluid technique (VOF)

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLOW OF FLUIDS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; OPTIMIZATION; SOLDERED JOINTS; SUBSTRATES;

CHARACTERISTIC BASED SPLIT (CBS) METHOD; FRONT TRACKING; UNDERFILL ENCAPSULATION; VOLUME OF FLUID TECHNIQUE (VOF);

ENCAPSULATION;

COMPUTER SIMULATION; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; ENCAPSULATION; FINITE ELEMENT METHOD; FLOW OF FLUIDS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; OPTIMIZATION; SOLDERED JOINTS; SUBSTRATES;

EID: 33745493138     PISSN: 00295981     EISSN: 10970207     Source Type: Journal    
DOI: 10.1002/nme.1704     Document Type: Article

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