The application of mold flow simulation in electronic package

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 330-334

  Chai, Kevin ^a   Liu, Vicky ^a   Wang, Y P ^a   Her, T D ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC COMPATIBILITY; MODIFIED ATMOSPHERE PACKAGING; MOLDING; MOLDS; PACKAGING MATERIALS; SURFACE ROUGHNESS;

CAVITY THICKNESS; DESIGN CYCLE-TIME; ELECTRONIC PACKAGE; MANUFACTURING COST; MODELING TECHNOLOGY; MOLDING DEFECTS; NUMERICAL RESULTS; SIMULATION MODEL;

PACKAGING;

EID: 77952009713     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904175     Document Type: Conference Paper

References (5)

1. L. T. Nguyen, "Reactive Flow simulation in Transfer Molding of IC Packages", IEEE, 1993.
2. Francis Su, Richard Lu and James Fan, "The Application of Cross-Flow Modeling Techniques for TSOP II 54L LOC Package", C-MOLD Asia/Pacific Microchip Encapsulation Users' Conference, Hsin-Chu, Taiwan, 1998.
3. Hung-Lung Lee, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, Francis Su and S. K. Chen, "Computer-Aided Design of a TSOP II LOC Package Using Taguchi's Parameter Design Method to Optimize Mold-Flow Balance", ChipMOS Technical symposium, Hsin-Chu, Taiwan, 1999.
4. C-MOLD Reactive Molding User's Guide, AC Technology, Ithaca, New York, 1995.
5. Matsuki Yamamoto and Yoshihiro Matsumura, "Flow Analysis of IC Encapsulating Resin in the Molding Process", Advances in Electronic Packaging, Volume 1, 1997.